Solderless Breadboard 830 Tie-points COM75 ,R13

DescriptionThis is your tried and true full size solderless breadboard! It has 2 split power buses, 10 columns, and 63 rows – with a total of 830 tie in points. All pins are spaced by a standard 0.1″. The two sets of five columns are separated by about 0.3″, perfect for straddling a DIP package over. The board accepts wire sizes in the range of 20-29AWG.This board also has a self-adhesive on the back. The boards also have interlocking parts, so you can hook as many together as you’d like.Dimensions: 6.5 x 2.1 x 0.38″ (165.1 x 54.29 x 9.68mm)Package includes: 1×Solderless Breadboard (830 tie in points)